PART |
Description |
Maker |
C450UT190-0319-30 C460UT190-0319-30 C450UT190-0318 |
Small Chip 190 x 190 x 85 Single Wire Bond Structure Cree UltraThin Gen III LEDs Small Chip 190 x 190 x 85 Single Wire Bond Structure
|
Cree, Inc Marktech Corporate
|
ATCWBR14701FGEW |
Wire Bond Resistors
|
List of Unclassifed Manufac...
|
TT160N16SOF |
Solder-Bond Technology
|
Infineon Technologies A...
|
TT320N16SOF |
Solder-Bond Technology
|
Infineon Technologies A...
|
TT190N16SOF |
Solder-Bond Technology
|
Infineon Technologies A...
|
MPE603EFE100LX |
32-BIT, 100 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
|
Motorola Mobility Holdings, Inc.
|
SML-LX19012UWC-WB7 |
7W, WIRELESS BOND LED MODULE
|
LUMEX INC.
|